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Metal substrate based electrodes for flexible dye-sensitized solar cells: fabrication methods, progress and
Suresh Kannan Balasingam1, Man Gu Kang, Yongseok Jun
1Department of Chemistry and KIER-UNIST Advanced Center for Energy, Ulsan National Institute of Science and Technology (UNIST), Ulsan 689-798, Republic of Korea.
Chemical Communications (Cambridge, England)
|November 8, 2013
Summary
Flexible dye-sensitized solar cells (DSSCs) are crucial for commercialization. This review compares plastic and metal substrates for flexible DSSCs, detailing fabrication and performance factors.
Area of Science:
- Materials Science
- Renewable Energy Engineering
- Photovoltaics
Background:
- Commercialization of dye-sensitized solar cells (DSSCs) necessitates advancements in engineering aspects like flexibility and cost-effective fabrication.
- Flexible DSSCs offer significant advantages, driving research into transparent conducting oxide coated plastic substrates and thin metallic foils.
Purpose of the Study:
- To compare the advantages and disadvantages of plastic and metal substrates for flexible DSSCs.
- To review the fabrication methods, working electrodes, and challenges associated with metal substrate-based flexible DSSCs.
- To cover recent developments in flexible metal substrate-based counter electrodes.
Main Methods:
- Comparative analysis of plastic and metal substrates for flexible DSSCs.
- Review of fabrication techniques for working electrodes on metal substrates.
- Discussion of high-temperature calcination effects and back illumination drawbacks.
Main Results:
- Metal substrates present specific fabrication challenges and performance considerations for flexible DSSCs.
- Plastic substrates offer a viable alternative, with potential integration with metal counter electrodes.
- High-temperature processing and back illumination are identified as key factors affecting performance.
Conclusions:
- Both plastic and metal substrates have distinct pros and cons for flexible DSSC applications.
- Further research is needed to optimize fabrication processes and overcome limitations for metal substrate-based flexible DSSCs.
- Integration strategies between different substrate types may offer pathways to improved flexible DSSC devices.
