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SELF ALIGNED TIP DEINSULATION OF ATOMIC LAYER DEPOSITED AL2O3 AND PARYLENE C COATED UTAH ELECTRODE ARRAY BASED NEURAL
Xianzong Xie1, Loren Rieth1, Sandeep Negi1
1Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT 84112 USA.
Summary
A new self-aligned process effectively deinsulates neural interface tips with alumina and Parylene C bi-layer encapsulation, improving device lifetime and performance. This method prevents micro-cracks and maintains electrical properties for reliable neural recording.
Area of Science:
- Biomaterials Science
- Neurotechnology
- Surface Engineering
Background:
- Neural interfaces, particularly Utah electrode arrays, face challenges in tip deinsulation due to complex geometries.
- Existing Parylene C insulation can lead to micro-cracks during deinsulation, impacting device reliability.
- Bi-layer encapsulation with alumina and Parylene C offers improved lifetime for neural interfaces.
Purpose of the Study:
- To develop and characterize a novel three-step self-aligned process for tip deinsulation of bi-layer encapsulated neural arrays.
- To evaluate the effectiveness of alumina and Parylene C bi-layer encapsulation in preventing micro-cracks during deinsulation.
- To assess the electrical properties and performance of deinsulated iridium oxide tips.
Main Methods:
- A three-step self-aligned deinsulation process involving laser ablation, O2 reactive ion etching, and buffered oxide etch.
- Characterization using scanning electron microscopy, atomic force microscopy, X-ray photoelectron spectroscopy, and electrochemical impedance spectroscopy.
- Evaluation of charge injection capacity, charge storage capacity, and impedance of deinsulated iridium oxide.
Main Results:
- The developed process successfully deinsulated bi-layer encapsulated arrays without causing micro-cracks in the iridium oxide.
- Bi-layer encapsulation prevented micro-cracks during laser ablation, a common issue with Parylene-only insulation.
- Deinsulated iridium oxide with bi-layer encapsulation showed higher charge injection capacity (320 nC vs 240 nC) and similar electrochemical impedance (2.5 kΩ) compared to Parylene-only insulation.
- Consistent tip impedances (median 32 kΩ) demonstrated the effectiveness and uniformity of the self-aligned deinsulation process.
Conclusions:
- The three-step self-aligned deinsulation process is effective for alumina and Parylene C bi-layer encapsulated neural interfaces.
- Bi-layer encapsulation significantly enhances the robustness of the deinsulation process, preventing critical micro-cracks.
- The improved deinsulation leads to enhanced electrical performance, crucial for reliable neural recording and stimulation.

