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Experimental Implementation of a New Composite Fabrication Method: Exposing Bare Fibers on the Composite Surface by the Soft Layer Method
Published on: October 6, 2017
Elastomeric thermal interface materials with high through-plane thermal conductivity from carbon fiber fillers
Kojiro Uetani1, Seisuke Ata, Shigeki Tomonoh
1Technology Research Association for Single Wall Carbon Nanotubes (TASC), 1-1-1 Higashi, Tsukuba, Ibaraki, 305-8565, Japan.
Abstract:
Electrostatic flocking is applied to create an array of aligned carbon fibers from which an elastomeric thermal interface material (TIM) can be fabricated with a high through-plane thermal conductivity of 23.3 W/mK. A high thermal conductivity can be achieved with a significantly low filler level (13.2 wt%). As a result, this material retains the intrinsic properties of the matrix, i.e., elastomeric behavior.
