Stress-induced light scattering method for the detection of latent flaws on fine polished glass substrates

Fine polishing techniques, such as the chemical mechanical polishing treatment, are one of the most important technique to glass substrate manufacturing. Mechanical interaction in the form of friction occurs between the abrasive and the substrate surface during polishing, which may cause formation of latent flaws on the glass substrate surface. Fine polishing-induced latent flaws may become obvious during a subsequent cleaning process if glass surfaces are corroded away by chemical interaction with the cleaning liquid. Latent flaws thus reduce product yield. In general, non-destructive inspection techniques, such as the light-scattering methods, used to detect foreign matters on the glass substrate surface. However, it is difficult to detect latent flaws by these methods because the flaws remain closed. Authors propose a novel inspection technique for fine polishing-induced latent flaws by combining the light scattering method with stress effects, referred to as the stress-induced light scattering method (SILSM). SILSM is able to distinguish between latent flaws and particles on the surface. In this method, samples are deformed by an actuator and stress effects are induced around the tips of latent flaws. Due to the photoelastic effect, the refractive index of the material around the tip of a latent flaw is changed. This changed refractive index is in turn detected by a cooled charge-coupled device camera as variations in light scattering intensity. In this report, surface latent flaws are detected non-destructively by applying SILSM to glass substrates, and the utility of SILSM evaluated as a novel inspection technique.