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Elevation of the temperature of liquid films caused by rapid rupturing
Susumu Kono1, Toshihiro Kaneko2, Ichiro Ueno2
1Department of Mechanical Engineering, Faculty of Science and Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan.
Abstract:
Although there have been several experimental and numerical works on rapidly rupturing films, measurement of the spatial-temporal temperature during rupturing processes is lacking. Using molecular dynamics simulations, we show that a rupturing film with nanometer thickness generates a non-negligible temperature increase. We demonstrate a correlation between the rupture velocity, the temperature increase, and the initial film thickness. Our findings show that the temperature increase causes changes to the physical properties, which affect the film-rupturing behavior.
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