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Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography
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Light-Sharing Interface for dMiCE Detectors using Sub-Surface Laser Engraving.

William C J Hunter1, Robert S Miyaoka1, Lawrence MacDonald1

  • 1University of Washington Department of Radiology, Seattle, WA USA.

IEEE Nuclear Science Symposium Conference Record. Nuclear Science Symposium
|December 16, 2014
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Summary
This summary is machine-generated.

Sub-surface laser engraving (SSLE) offers a cost-effective method for creating depth-of-interaction (DOI) resolving detectors. This technique achieved promising DOI resolution, suggesting future improvements with process optimization.

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Area of Science:

  • * Physics
  • * Crystallography
  • * Detector Technology

Background:

  • * The depth or interaction (DOI) resolving method, discrete mutual cahaya encoding (dMiCE), relies on interface treatment of crystal pairs.
  • * Previous dMiCE methods faced challenges with cost and repeatability of interface treatments.

Purpose of the Study:

  • * To investigate sub-surface laser engraving (SSLE) as an alternative method for creating depth-dependent interfaces in dMiCE detectors.
  • * To assess the preliminary performance of SSLE-fabricated dMiCE detectors for DOI resolution.

Main Methods:

  • * A first-generation SSLE system created a 100-micron thick partially reflective layer between two LYSO crystal halves.
  • * The crystal pair boundary was positioned between two Geiger-Müller avalanche photodiodes.
  • * Detector responses to 511-keV photons at varying depths were recorded and analyzed using maximum-likelihood estimation.

Main Results:

  • * An average DOI resolution of 3.4 mm was achieved with front-sided readout.
  • * An average DOI resolution of 3.9 mm was achieved with back-sided readout.
  • * These results were obtained despite using sub-optimal SSLE processing parameters.

Conclusions:

  • * Sub-surface laser engraving (SSLE) is a viable technique for fabricating DOI-resolving dMiCE detectors.
  • * Further optimization of the SSLE process and pattern is expected to significantly improve DOI resolution.