Atomic force microscopy deep trench and sidewall imaging with an optical fiber probe

We report a method to measure critical dimensions of micro- and nanostructures using the atomic force microscope (AFM) with an optical fiber probe (OFP). This method is capable of scanning narrow and deep trenches due to the long and thin OFP tip, as well as imaging of steep sidewalls with unique profiling possibilities by laterally tilting the OFP without any modifications of the optical lever. A switch control scheme is developed to measure the sidewall angle by flexibly transferring feedback control between the Z- and Y-axis, for a serial scan of the horizontal surface (raster scan on XY-plane) and sidewall (raster scan on the YZ-plane), respectively. In experiments, a deep trench with tapered walls (243.5 μm deep) and a microhole (about 14.9 μm deep) have been imaged with the orthogonally aligned OFP, as well as a silicon sidewall (fabricated by deep reactive ion etching) has been characterized with the tilted OFP. Moreover, the sidewall angle of TGZ3 (AFM calibration grating) was accurately measured using the switchable scan method.