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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Yan-Hong Ji1,2, Yu Liu1, Gui-Wen Huang1
1†Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
Researchers developed high-performance electrically conductive adhesives (ECAs) using a silver hybrid filler. This novel ternary system overcomes the conductivity-strength trade-off, enabling superior performance at lower silver content for advanced applications.
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