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Surface and interfacial analysis of sandblasted and acid-etched enamel for bonding orthodontic adhesives
Raphael Patcas1, Spiros Zinelis2, George Eliades3
1Senior research and teaching associate, Department of Orthodontics and Pediatric Dentistry, Center of Dental Medicine, University of Zurich, Zurich, Switzerland.
Introduction:
The purposes of this study were to characterize enamel surfaces treated with sandblasting, acid etching, or sandblasting followed by acid etching for bonding of orthodontic adhesives and to evaluate the enamel-adhesive interfaces.
Methods:
Buccal premolar surfaces were sandblasted, acid etched, sandblasted and subsequently acid etched, or left intact. For 2 treatments (acid etching and sandblasting plus acid etching), orthodontic brackets were bonded for resin infiltration assessment. Surface roughness and enamel loss were evaluated by optical profilometry, and surface morphology and elemental composition were examined by low-vacuum scanning electron microscope/energy dispersive x-ray analysis, whereas interfacial resin infiltration was assessed by high-vacuum scanning electron microscopy. Differences were statistically analyzed by 1-way analysis of variance and Tukey-Kramer multiple comparison tests or t tests (α = 0.05).
Results:
The sandblasted and sandblasted-plus-acid-etched groups showed higher surface roughness values than the acid-etched group. Sandblasting plus acid etching removed more enamel than did sandblasting or acid etching alone. Sandblasting plus acid etching demonstrated a more uniform type I etching pattern, without alumina particles implanted in the enamel, unlike sandblasting. No difference was found in the extent of resin infiltration between the bonded acid-etched and sandblasted-plus-acid-etched groups, although the latter showed improved infiltration characteristics.
Conclusions:
Sandblasting-plus-acid-etching treatment creates a rough enamel surface, typical of type I etching, with the greatest extent of enamel loss, free of alumina interferences, demonstrating the same extent of resin infiltration as acid etching, but exhibiting improved infiltration quality.
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