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Polymer waveguides for electro-optical integration in data centers and high-performance computers.

Roger Dangel, Jens Hofrichter, Folkert Horst

    Optics Express
    |April 4, 2015
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    Future data centers need advanced optical interconnects. This study introduces a new polymer waveguide technology and scalable method for electro-optical packaging, connecting silicon photonics chips to polymer waveguides.

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    Area of Science:

    • Photonics and Optical Engineering
    • Materials Science for Computing

    Background:

    • High-throughput optical interconnects are crucial for future data centers and high-performance computers.
    • Silicon photonics offers a path for integrating optics with computing hardware.
    • Electro-optical packaging remains a challenge for silicon photonics integration.

    Purpose of the Study:

    • To develop a novel single-mode polymer waveguide technology.
    • To create a scalable method for interfacing silicon photonics chips with polymer waveguides.
    • To address the electro-optical packaging challenge in silicon photonics.

    Main Methods:

    • Development of a new single-mode polymer waveguide fabrication process.
    • Design and implementation of a scalable optical interface architecture.
    • Integration of silicon photonics building blocks with polymer waveguides.

    Main Results:

    • Successful demonstration of a new single-mode polymer waveguide technology.
    • A scalable method for creating optical interfaces between silicon photonics and polymer waveguides was established.
    • Key electro-optical packaging challenges were addressed.

    Conclusions:

    • The presented polymer waveguide technology and interface method are promising for advanced optical interconnects.
    • This work contributes to the realization of tightly integrated silicon photonics for future computing systems.
    • The developed solution facilitates the connection of silicon photonics chips to polymer waveguides, advancing electro-optical packaging.