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Updated: Apr 15, 2026

Environmental Dynamic Mechanical Analysis to Predict the Softening Behavior of Neural Implants
Published on: March 1, 2019
Jae-Woong Jeong1, Gunchul Shin1, Sung Il Park1
1Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Recent advances in soft electronic interfaces offer new ways to integrate electronics with the brain for neuroscience research. These technologies enable minimally invasive procedures and conformal integration, overcoming limitations of traditional methods.
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