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Updated: Apr 11, 2026

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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
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Localized attachment of carbon nanotubes in microelectronic structures
Xavier Joyeux1, Paolo Mangiagalli1, Jean Pinson2
1Alchimer 15 rue du Buisson aux Fraises 91300 Massy (France).
Advanced Materials (Deerfield Beach, Fla.)
|June 5, 2015
Abstract:
Carbon Nanotubes (CNTs) are covalently modified by the monodiadozium salt of ethylene dianiline; further diazotation of the free amino group permits the selective attachment of these CNTs to the Si or Ti bottom of SiO2 trenches. The symmetrical electrografting of the bottom of the trenches, followed by the attachment of pristine CNTs, is also described.

