In situ UV nano-imprint lithography alignment using high contrast mark
Optics Express
|July 21, 2015
Summary
Researchers designed high contrast alignment marks for UV imprint lithography. These optimized marks improve Moiré fringe quality for precise in situ alignment, overcoming resist interference issues.
Area of Science:
- Nanofabrication
- Lithography
- Optical Metrology
Background:
- UV imprint lithography requires precise alignment for micro/nanofabrication.
- Existing alignment methods struggle with Moiré fringe contrast due to imprint resist interference.
Purpose of the Study:
- To design and fabricate high contrast alignment marks for improved in situ alignment in UV imprint lithography.
- To overcome the challenge of reduced Moiré fringe quality caused by imprint resist within patterns.
Main Methods:
- Rigorous coupled-wave analysis (RCWA) simulations were employed for mark design and optimization.
- Fabrication of the designed high contrast alignment marks.
- Experimental testing on an imprint alignment system.
Main Results:
- Simulations successfully guided the design of alignment marks that enhance Moiré fringe quality.
- Fabricated marks demonstrated feasibility and effectiveness in experimental tests.
- The designed marks effectively mitigate the contrast deterioration caused by imprint resist.
Conclusions:
- The developed high contrast alignment marks are effective for UV imprint lithography.
- RCWA simulations provide a reliable approach for optimizing alignment mark design.
- This work enables more accurate and reliable in situ alignment in imprint processes.


