Enhanced adhesion mechanisms between printed nano-silver electrodes and underlying polymer layers
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Updated: Apr 6, 2026

A Method to Fabricate Disconnected Silver Nanostructures in 3D
Published on: November 27, 2012
Tomohito Sekine1,2, Kenjiro Fukuda1,2,3, Daisuke Kumaki1,2
1Graduate School of Science and Engineering, Yamagata University 4-3-16 Jonan, Yonezawa, Yamagata 992-8510 Japan.
Abstract:
We have characterized mechanisms to improve the adhesion between printed electrodes prepared from silver nanoparticle inks and underlying polymer layers. Adhesion strength was significantly improved by sintering the inks above the glass transition temperature of the polymer underlayers, whereby enhanced adhesion was realized through interfacial fusion between the silver electrode layer and the underlying polymer layer. The surface energy of the underlayer was found to be an important factor in the improvement of adhesive strength, in that larger and thicker interfused regions between layers were observed for underlayers that had higher surface energies.

