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Enhanced adhesion mechanisms between printed nano-silver electrodes and underlying polymer layers
Tomohito Sekine1, Kenjiro Fukuda, Daisuke Kumaki
1Graduate School of Science and Engineering, Yamagata University 4-3-16 Jonan, Yonezawa, Yamagata 992-8510 Japan. Research Center for Organic Electronics, Yamagata University 4-3-16 Jonan, Yonezawa, Yamagata 992-8510 Japan.
Nanotechnology
|July 25, 2015
Summary
Improving printed electrode adhesion involves sintering silver nanoparticle inks above the polymer
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- Printed electronics require robust adhesion between components.
- Silver nanoparticle inks are used for conductive electrodes.
- Interfacial adhesion is critical for device reliability.
Purpose of the Study:
- To investigate methods for enhancing adhesion between silver nanoparticle printed electrodes and polymer substrates.
- To understand the mechanisms governing this interfacial adhesion.
Main Methods:
- Characterization of adhesion mechanisms.
- Sintering silver nanoparticle inks at temperatures above the polymer's glass transition temperature.
- Analysis of interfacial fusion and surface energy effects.
Main Results:
- Adhesion strength significantly improved by sintering above the glass transition temperature.
- Enhanced adhesion achieved through interfacial fusion between silver electrodes and polymer layers.
- Higher surface energy polymer underlayers resulted in larger and thicker interfused regions, improving adhesion.
Conclusions:
- Sintering temperature relative to polymer glass transition temperature is key for robust electrode adhesion.
- Interfacial fusion and polymer surface energy are critical factors for strong adhesion in printed electronics.
