An exceptionally conductive hydrogel for all-organic, ultraflexible, and chronic neural interfaces

Chronic neural interfaces are essential for advancing brain-computer interfaces, neuroprosthetics, and neuromodulation technologies. However, a long-standing trade-off between performance and longevity persists due to the scarcity of materials that simultaneously achieve superior electrical performance, mechanical compliance, and biocompatibility. Here, we overcome this limitation with an all-organic, ultraflexible electrocorticography (ECoG) design that features a thickness of only 9 µm, achieving low electrode-tissue impedance and durability in vivo. Central to this design is a conductive hydrogel featuring an interfacial percolation (CHIP) microstructure, with tunable hydration levels and softness, achieving a highest in-plane electrical conductivity of 2,512 S cm^-1. We further developed an in-plane swelling control with a dry, soft-protective etching strategy that preserves the structural integrity during hydrogel processing. The resulting all-organic ECoG array conforms to the cortical surface, minimizing foreign body response and providing exceptional signal quality, with the longest record up to 550 d.