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Negative Additive Manufacturing of Complex Shaped Boron Carbides
Published on: September 18, 2018
Microalloying Boron Carbide with Silicon to Achieve Dramatically Improved Ductility
1Materials and Process Simulation Center (Mail Code 139-74), California Institute of Technology, 1200 East California Boulevard, Pasadena, California 91125, United States.
Microalloying boron carbide (B4C) with silicon-silicon bonds significantly enhances its ductility, enabling it to withstand greater impact without brittle failure. This breakthrough retains B4C
Area of Science:
- Materials Science
- Computational Materials Science
- Solid State Physics
Background:
- Boron carbide (B4C) is a hard ceramic with potential in applications like body armor.
- Its widespread use is hindered by brittleness under impact.
- Improving ductility without compromising hardness is crucial for advanced engineering applications.
Purpose of the Study:
- To investigate microalloying as a strategy to enhance boron carbide ductility.
- To explore the effects of substituting carbon-boron-carbon chains with silicon-silicon linkages.
- To computationally assess the mechanical properties of modified boron carbide structures.
Main Methods:
- Utilized density functional theory (DFT) for atomistic simulations.
- Examined the mechanical response of boron carbide under shear stress.
- Compared the behavior of pristine B4C with a modified structure, (B11C)-Si2.
Main Results:
- Replacing CBC chains with Si-Si linkages in B4C, forming (B11C)-Si2, dramatically improved ductility.
- The modified material sustained a shear strain of 0.802 without brittle failure, approximately double that of B4C.
- (B11C)-Si2 maintained low density and high hardness comparable to B4C.
Conclusions:
- Microalloying B4C with Si-Si bonds is an effective method to enhance ductility.
- The Si-Si linkages facilitate shear accommodation through icosahedral rotation, preventing bond breakage.
- This modified boron carbide offers a promising route for developing tougher, high-performance materials.
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