Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites

Area of Science:

• Materials Science
• Nanotechnology
• Thermal Engineering

Background:

• Interfacial thermal resistance hinders performance in energy conversion technologies.
• Thermomechanical stress at interfaces reduces device lifespan.
• Vertically aligned metal nanowires (NWs) offer combined thermal and mechanical benefits.

Purpose of the Study:

• To synthesize uniform copper NW arrays for improved thermal management.
• To investigate the thermal conductivity and anisotropic properties of these NW arrays.
• To explore the potential of NW arrays infiltrated with phase change materials.

Main Methods:

• Templated electrodeposition of copper NW arrays on substrates.
• Use of a sacrificial overplating layer for enhanced uniformity.
• 3-omega method for measuring axial thermal conductivity.
• Infiltration with organic phase change material.

Main Results:

• Achieved high axial thermal conductivity up to 70 W m⁻¹ K⁻¹ in freestanding copper NW arrays.
• Demonstrated highly anisotropic thermal properties with lateral conductivity of 1-2 W m⁻¹ K⁻¹.
• Preserved thermal properties after infiltrating NW arrays with phase change material.

Conclusions:

• Copper NW arrays offer superior thermal conductance compared to commercial materials.
• The anisotropic nature and high axial conductivity are crucial for thermal management applications.
• Templated electrodeposition is a viable method for producing NW arrays for enhanced heat transfer.