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Published on: August 2, 2019
Electronic cooling via interlayer Coulomb coupling in multilayer epitaxial graphene
Momchil T Mihnev1,2, John R Tolsma3, Charles J Divin1,2
1Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109, USA.
Coulomb interactions enable heat transfer between layers in multilayer graphene, overcoming weak phonon coupling. This finding is crucial for understanding thermal transport in two-dimensional (2D) materials.
Area of Science:
- Condensed Matter Physics
- Materials Science
- Nanotechnology
Background:
- In layered two-dimensional (2D) materials, electronic states are confined within layers, limiting interlayer transport.
- Weak van der Waals forces result in poor thermal coupling between layers, hindering heat dissipation.
- Electron-phonon interactions are typically confined to within individual layers.
Purpose of the Study:
- To investigate the role of interlayer Coulomb interactions in thermal transport in multilayer epitaxial graphene.
- To demonstrate an alternative mechanism for heat transfer beyond phonon-mediated coupling.
- To explain the observed hot-carrier dynamics in ultrafast spectroscopy experiments.
Main Methods:
- Ultrafast time-resolved terahertz spectroscopy to probe hot-carrier dynamics.
- Development of a theoretical model for interlayer Coulomb coupling.
- Experimental variation of temperature and number of layers to observe trends.
Main Results:
- Coulomb interactions between electrons in different layers facilitate significant interlayer thermal transport.
- This Coulombic mechanism is effective even with strong electron confinement within individual 2D layers.
- The developed theory accurately predicts experimental observations without free parameters.
Conclusions:
- Interlayer Coulomb interactions represent a key pathway for thermal transport in multilayer 2D materials.
- This mechanism challenges the conventional understanding of heat transfer limitations in such systems.
- The findings have implications for thermal management in nanoscale electronic devices.
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