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Updated: Mar 31, 2026
Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography
Published on: May 15, 2017
Research on defects inspection of solder balls based on eddy current pulsed thermography
Xiuyun Zhou1,2, Jinlong Zhou3, Guiyun Tian4,5
1School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China. zhouxy@uestc.edu.cn.
Abstract:
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.
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