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A self-adjustable four-point probing system using polymeric three dimensional coils and non-toxic liquid metal
Nomin-Erdene Oyunbaatar1, Young Soo Choi, Yong Soo Choi1
1MEMS and Nanotechnology Laboratory, School of Mechanical Engineering, Chonnam National University, Gwangju 500757, South Korea.
The Review of Scientific Instruments
|January 3, 2016
Summary
A novel self-adjustable four-point probe system precisely measures electrical properties of flexible and large-step-height microsamples. This innovative probe utilizes 3D printed coil springs and liquid metal for accurate characterization of various materials.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Accurate electrical property measurement is crucial for advanced materials.
- Characterizing flexible and micro-scale samples presents significant challenges.
- Existing four-point probe systems often lack adaptability for diverse sample topographies.
Purpose of the Study:
- To develop and demonstrate a self-adjustable four-point probe (S4PP) system.
- To enable precise electrical property measurements on flexible and large-step-height microsamples.
- To overcome limitations of conventional probe systems in complex sample geometries.
Main Methods:
- Fabrication of a S4PP system using 3D printed polymer (PMMA) coil springs and non-toxic liquid metal.
- Integration of a LabView-based control system for independent probe adjustment.
- Experimental validation through measurement of Cr and Au thin films on silicon wafers, flexible diaphragms, and samples with significant step heights.
Main Results:
- Successful measurement of specific resistance for Cr and Au thin films.
- Demonstrated capability to characterize electrical properties of a thin Au film on a flexible silicon diaphragm.
- Accurate resistance characterization of Cr thin films with 60 and 90 μm step heights.
Conclusions:
- The proposed S4PP system offers a versatile solution for electrical property measurements.
- The system is effective for both rigid and flexible substrates with varying surface topographies.
- This technology has broad applicability for common metals, semiconductors, and micro-scale devices.
