Intermetallic Formation at Interface of Al/Cu Clad Fabricated by Hydrostatic Extrusion and Its Properties

Al/Cu clad composed of Al core and Cu sheath has been produced by hydrostatic extrusion at 523 K, at an extrusion rate of 27. The prepared specimen was post-annealed at temperatures of 673 K and 773 K for various time durations, and the effect of annealing conditions have been analyzed. The hardness at the interface between Al and Cu matrix of the Al/Cu bimetal clad increases because of annealing. Results indicate that the hardness is more sensitive to annealing temperature than the annealing time. Three kinds of intermetallic compounds (IMC), namely, CuAl, Cu3Al2, and CuAl2, are formed at the Al-Cu interface, upon annealing at 673 K. On the other hand, four kinds of IMCs, namely, Cu4Al3, CuAl, Cu3Al2, CuAl2, are formed at the annealing temperature of 773 K. The growth of each IMC follows the parabolic law as a function of annealing times at certain annealing temperature. The growth rate of each IMC is limited to its interdiffusion rate constant. The IMC Cu4Al3 appears upon annealing at 773 K, and not during annealing at 673 K, because of the higher value of activation energy associated with its formation, when compared to other IMCs.