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Lu Wang1, David Freedman2, Mesut Sahin3
1Department of Electrical and Computer Engineering, Boston University, 8 Saint Mary's St, Boston 02215, MA, USA. wanglu@bu.edu.
This study presents a novel neural recording integrated circuit (IC) chip that seamlessly integrates active circuits with electrodes using IBM C4 bumps. This scalable design offers a cost-effective solution for high-density neural recording arrays.
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