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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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Microscale Soft Patterning for Solution Processable Metal Oxide Thin Film Transistors.
Sang Wook Jung1,2, Soo Sang Chae1, Jee Ho Park1
1Department of Materials Science and Engineering, Yonsei University , 134 Shinchong-dong, Seoul 120-750, South Korea.
ACS Applied Materials & Interfaces
|February 27, 2016
Summary
We developed a microscale soft patterning (MSP) method using poly(dimethylsiloxane) (PDMS) layers for fabricating high-performance metal oxide semiconductor thin-film transistors (TFTs). This technique offers improved mobility and reduced hysteresis compared to traditional methods.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Device Fabrication
Background:
- Metal oxide semiconductors (MOSs) are crucial for next-generation electronics.
- Conventional photolithography faces limitations in achieving high resolution and compatibility with solution-processed materials.
- Protecting MOS from environmental factors like water is essential for device stability.
Purpose of the Study:
- To introduce a novel microscale soft patterning (MSP) technique for fabricating MOS thin-film transistors (TFTs).
- To demonstrate the effectiveness of MSP using poly(dimethylsiloxane) (PDMS) as a release and protective layer.
- To compare the performance of MSP-fabricated TFTs with those made by conventional photolithography.
Main Methods:
- Utilizing contact printing of sub-nanometer thick low molecular weight (LMW) poly(dimethylsiloxane) (PDMS) layers.
- Employing PDMS as a release agent between n-type Ohmic metal and MOS.
- Demonstrating patterning of solution-processable In2O3, IZO, and IGZO TFTs with aluminum (Al) electrodes.
- Achieving patterning gaps as small as 13 μm.
Main Results:
- Successfully fabricated solution-processable In2O3, IZO, and IGZO TFTs using the MSP route.
- Demonstrated the capability of MSP to create fine patterning with gaps as small as 13 μm.
- TFTs fabricated via MSP exhibited superior field-effect mobility compared to conventional photolithography.
- MSP-fabricated TFTs showed reduced hysteresis, indicating improved device stability.
Conclusions:
- The microscale soft patterning (MSP) route is a viable and effective method for fabricating high-performance MOS TFTs.
- MSP offers advantages over conventional photolithography, including enhanced mobility and reduced hysteresis.
- The use of PDMS layers in MSP provides both release and protective functionalities for MOS devices.

