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A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

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Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality.

Naser Naserifar¹, Philip R LeDuc², Gary K Fedder³

¹Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA.

Advanced Materials (Deerfield Beach, Fla.)

|March 19, 2016

Summary

This summary is machine-generated.

Researchers developed a stretchable electronic substrate using soft polymer layers around silicon chips. Adding one polymer layer significantly increased stretchability, allowing the substrate to stretch over twice its original length without failure.

Keywords:

embedded silicon chips energy strain rates poly(dimethylsiloxane)stiffness gradients stretchable electronics

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Area of Science:

Materials Science
Polymer Science
Electronics Engineering

Background:

Conventional electronics are rigid and prone to failure under mechanical stress.
Developing stretchable electronic substrates is crucial for flexible and wearable devices.
Existing stretchable materials often compromise on performance or durability.

Purpose of the Study:

To engineer a novel stretchable electronic substrate with enhanced mechanical properties.
To investigate the effect of polymer layering on substrate stiffness and stretchability.
To create a controllable stiffness gradient for improved device integration.

Main Methods:

Fabrication of a multi-layered polymer substrate incorporating silicon chip surrogates.
Systematic variation of the number of intermediate polymer layers.
Mechanical testing to determine strain failure threshold and delamination resistance.

Main Results:

A six-fold increase in the strain failure threshold was achieved by adding a single intermediate polymer layer.
The modified substrate demonstrated stretchability exceeding twice its original length.
A controllable stiffness gradient was successfully implemented within the substrate.

Conclusions:

The proposed multi-layered polymer approach effectively enhances the stretchability and durability of electronic substrates.
Strategic layering of polymers offers a viable method for tuning mechanical properties of stretchable electronics.
This technology holds promise for advanced flexible and wearable electronic applications.