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Fully-integrated, bezel-less transistor arrays using reversibly foldable interconnects and stretchable origami
Mijung Kim1, Jihun Park, Sangyoon Ji
1School of Materials Science and Engineering, Wearable Electronics Research Group, Low-Dimensional Carbon Materials Research Center, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Republic of Korea. jangung@unist.ac.kr.
Nanoscale
|April 23, 2016
Summary
Researchers developed fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. This innovation allows for reversible folding, paving the way for advanced flexible electronics.
Area of Science:
- Materials Science
- Electrical Engineering
- Robotics
Background:
- Flexible electronics face challenges in integration and durability.
- Current designs often lack seamless integration of components for complex folding.
Purpose of the Study:
- To demonstrate fully-integrated, bezel-less transistor arrays.
- To enable reversible folding of electronic arrays using novel substrate and interconnect designs.
Main Methods:
- Utilized stretchable origami substrates with rigid support fixtures and foldable elastic joints.
- Developed hybrid conducting interconnects using thin metal films and metallic nanowires on elastomeric joints.
Main Results:
- Successfully created fully-integrated, bezel-less transistor arrays.
- Achieved reversible folding of these electronic arrays.
- Demonstrated the functionality of hybrid interconnects on foldable joints.
Conclusions:
- Origami substrates and foldable interconnects enable robust, foldable transistor arrays.
- This approach is promising for advanced applications in wearable devices and robotics.
