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Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism.

Barbara Putz1, Oleksandr Glushko1, Megan J Cordill1

  • 1Erich Schmid Institute of Materials Science, Austrian Academy of Sciences and Department of Materials Physics , Montanuniversität Leoben, Jahnstrasse 12, Leoben 8700 , Austria.

Materials Research Letters
|May 10, 2016
PubMed
Summary

Electromigration (EM) is becoming crucial for flexible electronics as devices demand higher current densities. This study shows EM in gold thin films on polyimide can act as a self-healing mechanism.

Keywords:
ElectromigrationFlexible ElectronicsSelf-healingThin Films

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Reliability Engineering

Background:

  • Electromigration (EM) in flexible thin film systems was previously a minor concern due to low current densities.
  • Increasing power demands in flexible electronics necessitate higher current densities, elevating EM as a critical reliability issue.

Purpose of the Study:

  • To investigate electromigration phenomena in gold thin films on flexible polyimide substrates under high current densities.
  • To assess the potential of electromigration as a self-healing mechanism in advanced flexible electronic applications.

Main Methods:

  • Fabrication of 50 nm gold thin films with a 10 nm chromium adhesion layer on a polyimide substrate.
  • Application of high current densities to induce and study electromigration effects.
  • Microscopic analysis to observe electromigration-induced changes.

Main Results:

  • Electromigration was observed to occur in the gold thin films under high current densities.
  • Evidence suggests that electromigration can lead to the formation of conductive pathways, potentially enabling self-healing.
  • The behavior of electromigration was characterized in this specific flexible thin film system.

Conclusions:

  • Electromigration is a relevant reliability concern for future high-power flexible electronics.
  • The findings suggest a novel application of electromigration as a self-healing mechanism in flexible devices.
  • Further research is warranted to optimize this self-healing capability for practical implementation.