Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Metallic Solids02:37

Metallic Solids

18.8K
Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
18.8K
Yield Criteria for Ductile Materials under Plane Stress01:25

Yield Criteria for Ductile Materials under Plane Stress

218
In designing structural elements and machine parts using ductile materials, it is crucial to ensure that these components withstand applied stresses without yielding. Yielding is initially determined through a tensile test, which evaluates the material's response to uniaxial stress. However, tensile stress is insufficient when components face biaxial or plane stress conditions This condition requires advanced criteria to predict failure.
The Maximum Shearing Stress Criterion, also known as...
218
Theory of Metallic Conduction01:17

Theory of Metallic Conduction

1.4K
The conduction of free electrons inside a conductor is best described by quantum mechanics. However, a classical model makes predictions close to the results of quantum mechanics. It is called the theory of metallic conduction.
In this theory, Newton's second law of motion is used to determine the acceleration of an electron in the presence of an applied electric field. Then, its velocity is expressed via this acceleration.
An electron moves through the crystal, containing positive ions,...
1.4K
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

519
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
519
Unsymmetric Loading of Thin-Walled Members: Problem Solving01:07

Unsymmetric Loading of Thin-Walled Members: Problem Solving

172
The shear center of a channel section with uniform thickness, height, and width, is determined by computing the shear force in the member and calculating the moments of inertia of the sections.
To compute the shear forces, find the shear flow at a specific distance from the endpoint using the vertical shear and the moment of inertia values. The total shear force on the flange is calculated by integrating the shear flow from one end of the flange to the other.
Next, calculate the moments of...
172

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Prevalence of Vitamin D Deficiency in a Large Newborn Cohort from Northern United States and Effect of Intrauterine Drug Exposure.

Nutrients·2020
Same author

DNA Methylation and Bladder Cancer: Where Genotype does not Predict Phenotype.

Current genomics·2020
Same author

Diagnostic performance of EUS in non-jaundiced patients with an incidental finding of double duct sign on cross-sectional imaging: A systematic review and meta-analysis.

Pancreatology : official journal of the International Association of Pancreatology (IAP) ... [et al.]·2020
Same author

Giant Liver Hemangiomas: A Plea for Early Surgical Referral and Resection.

Case reports in surgery·2020
Same author

DeconPeaker, a Deconvolution Model to Identify Cell Types Based on Chromatin Accessibility in ATAC-Seq Data of Mixture Samples.

Frontiers in genetics·2020
Same author

The lurking scourge of multidrug resistant Candida auris in times of COVID-19 pandemic.

Journal of global antimicrobial resistance·2020
Same journal

Efficient methods for wave propagation in electron microscopy.

Ultramicroscopy·2026
Same journal

Unsupervised deep image prior for sparse-view and limited-angle electron tomography.

Ultramicroscopy·2026
Same journal

Determination of the structure of the tertiary phase in the alloy Al<sub>10</sub>Mo<sub>10</sub>Nb<sub>10</sub>Ta<sub>10</sub>Ti<sub>30</sub>Zr<sub>30</sub> using convergent beam electron diffraction.

Ultramicroscopy·2026
Same journal

Predictive drift compensation of multi-frame STEM via live scan modification.

Ultramicroscopy·2026
Same journal

Deep PACBED: Multitask analysis of PACBED images using deep neural networks.

Ultramicroscopy·2026
Same journal

Guided progressive reconstructive imaging: A new quantization-based framework for low-dose, high-throughput and real-time analytical ptychography.

Ultramicroscopy·2026
See all related articles

Related Experiment Video

Updated: Sep 16, 2025

Indirect Fabrication of Lattice Metals with Thin Sections Using Centrifugal Casting
08:32

Indirect Fabrication of Lattice Metals with Thin Sections Using Centrifugal Casting

Published on: May 14, 2016

12.6K

Data-efficient 4D-STEM in SEM: Beyond 2D materials to metallic materials.

Ujjval Bansal1, Amit Sharma2, Barbara Putz3

  • 1Institute for Applied Materials, Karlsruhe Institute of Technology, Karlsruhe 76131, Germany.

Ultramicroscopy
|July 10, 2025
PubMed
Summary
This summary is machine-generated.

Four-dimensional scanning transmission electron microscopy (4D-STEM) in SEM now offers faster acquisition and higher angular resolution. This advancement enables detailed imaging of materials like platinum-copper thin films and FIB-prepared copper.

Keywords:
4D-STEMDiffractionEvent-driven modePixelated detectorSEM

More Related Videos

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory
08:58

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory

Published on: March 7, 2018

9.5K
4D Printed Bifurcated Stents with Kirigami-Inspired Structures
06:52

4D Printed Bifurcated Stents with Kirigami-Inspired Structures

Published on: July 25, 2019

8.1K

Related Experiment Videos

Last Updated: Sep 16, 2025

Indirect Fabrication of Lattice Metals with Thin Sections Using Centrifugal Casting
08:32

Indirect Fabrication of Lattice Metals with Thin Sections Using Centrifugal Casting

Published on: May 14, 2016

12.6K
Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory
08:58

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory

Published on: March 7, 2018

9.5K
4D Printed Bifurcated Stents with Kirigami-Inspired Structures
06:52

4D Printed Bifurcated Stents with Kirigami-Inspired Structures

Published on: July 25, 2019

8.1K

Area of Science:

  • Materials Science and Engineering
  • Electron Microscopy
  • Nanotechnology

Background:

  • Four-dimensional scanning transmission electron microscopy (4D-STEM) integrates spatial and diffraction data, enhanced by direct electron detector technology.
  • Current 4D-STEM applications are primarily in transmission electron microscopy (TEM) and scanning electron microscopy (SEM), with ongoing efforts to adapt it for SEM.

Purpose of the Study:

  • To advance 4D-STEM capabilities within scanning electron microscopy (SEM).
  • To enhance acquisition speed, data size, angular resolution, and material applicability of 4D-STEM in SEM.

Main Methods:

  • Utilized a MiniPIX Timepix3 detector in event-driven mode for faster acquisition and reduced data size.
  • Implemented a novel stage-detector geometry to achieve a 160 mm camera length, improving angular resolution.
  • Applied 4D-STEM to image nanostructured platinum-copper thin films and identify annealing twins in FIB-prepared copper.

Main Results:

  • Achieved a significant improvement in acquisition rate using the event-driven mode, enabling in situ SEM testing.
  • Enhanced angular resolution allows for advanced applications like magnetic or electric field imaging.
  • Successfully imaged materials with nanoscale features (16 nm grain size) and identified microstructural features like annealing twins.

Conclusions:

  • Demonstrated the potential of 4D-STEM in SEM for faster, higher-resolution imaging across diverse materials.
  • Highlighted the synergy of 4D-STEM with in situ experiments for advanced materials analysis.
  • Broadened the application scope of 4D-STEM in SEM for various material science investigations.