Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Vector vortex alkali laser amplifier.

Optics letters·2026
Same author

L-Carnitine Regulates Regeneration of Human Hematopoietic Stem and Progenitor Cells.

Blood·2026
Same author

Determining Olefinic and Phenolic Fractions in Dissolved Organic Matter by Ozonation with Stable Oxygen Isotope Analysis of H<sub>2</sub>O<sub>2</sub>.

Environmental science & technology·2026
Same author

Plant derived tannic acid-based tissue adhesives: From mechanism to advanced design.

Acta biomaterialia·2026
Same author

Prediction of antibiotic-associated cutaneous adverse drug reactions using electronic health record foundation models.

NPJ digital medicine·2026
Same author

Transforming unstructured breast cancer pathology reports into the Observational Medical Outcomes Partnership Common Data Model.

BMC medical informatics and decision making·2026

Related Experiment Video

Updated: Mar 17, 2026

Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.9K

Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing.

Hohyun Keum1, Zining Yang1, Kewen Han1

  • 1Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA.

Scientific Reports
|July 19, 2016
PubMed
Summary

This study introduces a novel microassembly technique for creating complex microsystems. It enables the integration of diverse materials like semiconductors, metals, dielectrics, and polymers using reversible adhesion and thermal processing for robust joining.

More Related Videos

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing
08:45

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

Published on: November 9, 2015

8.2K
Laser-induced Forward Transfer of Ag Nanopaste
08:07

Laser-induced Forward Transfer of Ag Nanopaste

Published on: March 31, 2016

11.9K

Related Experiment Videos

Last Updated: Mar 17, 2026

Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.9K
Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing
08:45

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

Published on: November 9, 2015

8.2K
Laser-induced Forward Transfer of Ag Nanopaste
08:07

Laser-induced Forward Transfer of Ag Nanopaste

Published on: March 31, 2016

11.9K

Area of Science:

  • Materials Science
  • Micro-engineering
  • Nanotechnology

Background:

  • Microassembly of heterogeneous materials is crucial for advanced microsystems in electronics and photonics.
  • Challenges exist in deterministic transfer and joining of dissimilar microscale materials due to dominant surface adhesion.

Purpose of the Study:

  • To present a new approach for assembling microsystems using diverse material classes.
  • To demonstrate reliable joining of microscale heterogeneous materials.

Main Methods:

  • Utilized reversible adhesion-based transfer printing for material transfer.
  • Employed thermal processing for microscale material joining.
  • Investigated interfacial joining characteristics using blister tests.

Main Results:

  • Successfully assembled microsystems using semiconductors, metals, dielectrics, and polymers.
  • Demonstrated robust interfacial joining through systematic characterization.
  • Validated device-level functionality with optical and electrical micro-devices.

Conclusions:

  • The developed approach enables 3D heterogeneous material integration for microsystems.
  • This method overcomes challenges in microscale assembly of dissimilar materials.
  • Opens new possibilities for fabricating advanced microsystems with unique functionalities.