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Published on: July 21, 2018
Wiring up pre-characterized single-photon emitters by laser lithography
Q Shi1, B Sontheimer2, N Nikolay2
1Institute of Applied Physics, Karlsruhe Institute of Technology (KIT), 76128 Karlsruhe, Germany.
Researchers developed a 3D fabrication method to connect many single-photon emitters using photonic wires. This technique enables the creation of advanced quantum optical chips with integrated components for enhanced performance.
Area of Science:
- Quantum optics
- Nanotechnology
- Materials science
Background:
- Future quantum optical chips require integration of multiple components like single-photon emitters and detectors.
- Scalable methods for precisely wiring these components in 3D are crucial for chip functionality.
Purpose of the Study:
- To introduce a scalable 3D fabrication technique for integrating single-photon emitters into quantum optical chips.
- To demonstrate the creation of functional 3D waveguide elements with integrated emitters.
Main Methods:
- Localization and characterization of nitrogen vacancies in nanodiamonds within a low-fluorescence photoresist.
- Aligned 3D laser lithography performed in situ using the same optical instrument.
- Fabrication and characterization of 3D crossed-arc waveguide elements housing single-photon emitters.
Main Results:
- Successful demonstration of a scalable optical localization-selection-lithography procedure.
- Creation of 3D functional waveguide elements with precisely positioned single-photon emitters.
- Integrated optical excitation and efficient background suppression achieved within the fabricated elements.
Conclusions:
- The developed procedure offers a scalable pathway for fabricating complex 3D quantum optical circuits.
- This method facilitates the integration of single-photon emitters, crucial for advancing quantum technologies.
- The fabricated waveguide elements demonstrate potential for efficient light manipulation and signal isolation in quantum chips.
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