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Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response.

Nuno Brito1, Carlos Ferreira2, Filipe Alves3

  • 1Algoritmi Center, University of Minho, Guimarães 4800-058, Portugal. nuno.brito@algoritmi.uminho.pt.

Sensors (Basel, Switzerland)
|September 23, 2016
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Summary

This study introduces a digital solution for rapid testing of microelectromechanical system (MEMS) inertial sensors. The system achieves fast, full-wafer characterization, improving upon traditional integrated circuit (IC) testing methods.

Keywords:
field programmable gate arraysmicroelectromechanical devicesmicroprocessors

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Mechanical Engineering

Background:

  • Microelectromechanical system (MEMS) devices possess unique multiphysics characteristics, challenging traditional integrated circuit (IC) testing methodologies.
  • Current MEMS testing methods lag behind the advanced design and manufacturing capabilities seen in the IC industry.

Purpose of the Study:

  • To present a complete digital solution for the rapid testing and characterization of MEMS inertial sensors.
  • To enable fast, full-wafer testing of MEMS devices with built-in actuation mechanisms.

Main Methods:

  • A digital system integrating a processor with tailored signal acquisition, processing, control, and actuation modules was developed.
  • The system analyzes structure position and response in real-time under controlled actuation signals.
  • A full electrical approach allows for flexible adaptation to other physical domains.

Main Results:

  • The system measures resonant frequency (Fr), quality factor (Q), and pull-in voltage (Vpi) within 1.5 seconds.
  • Achieved repeatability is better than 5 parts per thousand (ppt).
  • A full-wafer test of 420 devices successfully identified faulty units and provided design feedback.

Conclusions:

  • The developed digital system offers a flexible and powerful tool for evaluating MEMS inertial sensors and control algorithms.
  • This approach significantly enhances the speed and efficiency of MEMS device characterization.
  • The system facilitates early detection of faulty devices and provides valuable design insights.