Atomic and molecular layer deposition: off the beaten track

Area of Science:

• Materials Science and Nanotechnology
• Chemical Engineering
• Surface Chemistry

Background:

• Atomic Layer Deposition (ALD) is a precise thin-film deposition technique enabling atomic-level control.
• ALD is traditionally used in semiconductor manufacturing but has potential for broader material synthesis.
• Molecular Layer Deposition (MLD) is the organic analogue to ALD, expanding material possibilities.

Purpose of the Study:

• To review recent advancements in ALD and MLD, highlighting their departure from traditional semiconductor applications.
• To identify novel materials and unexplored avenues for ALD/MLD in catalysis, energy storage, and health.
• To critically analyze the impact of process conditions (temperature, pressure, time) on ALD growth.

Main Methods:

• Review of recent literature on ALD and MLD developments.
• Emphasis on applications using high-surface-area substrates.
• Analysis of process condition effects and reactor innovations.

Main Results:

• ALD and MLD are increasingly used for novel nanostructured materials beyond silicon wafers.
• New surface chemistries, process conditions, and reactor designs are emerging for diverse applications.
• Understanding process parameters is crucial for optimizing ALD growth on various substrates.

Conclusions:

• ALD and MLD technologies are evolving significantly, moving beyond their semiconductor origins.
• Further research into novel chemistries, process optimization, and reactor design will unlock new applications.
• ALD/MLD hold significant promise for advanced materials in catalysis, energy, and biomedical fields.