Related Experiment Video
Updated: Mar 13, 2026
Fabrication of Thin Film Silver/Silver Chloride Electrodes with Finely Controlled Single Layer Silver Chloride
Published on: July 1, 2020
Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
Chenhuinan Wei1, Guoxing Wu1, Sanjun Yang1
1School of Physics and Technology, Key Laboratory of Ariticial Micro- and Nano-structures of Ministry of Education, Wuhan University, Wuhan 430072, China.
Abstract:
In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films.
More Related Videos
08:26Spray-Coated Melanin/PEDOT:PSS Films for Sustainable Organic Electrochemical Transistors
Published on: October 28, 2025
08:14Improved Heterojunction Quality in Cu2O-based Solar Cells Through the Optimization of Atmospheric Pressure Spatial Atomic Layer Deposited Zn1-xMgxO
Published on: July 31, 2016
