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Updated: Mar 12, 2026

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Carbon nanotube dry adhesives with temperature-enhanced adhesion over a large temperature range
Ming Xu1,2, Feng Du1, Sabyasachi Ganguli3
1Center of Advanced Science and Engineering for Carbon (Case4Carbon), Department of Macromolecular Science and Engineering, Case Western Reserve University, 10900 Euclid Avenue, Cleveland, Ohio 44106, USA.
Abstract:
Conventional adhesives show a decrease in the adhesion force with increasing temperature due to thermally induced viscoelastic thinning and/or structural decomposition. Here, we report the counter-intuitive behaviour of carbon nanotube (CNT) dry adhesives that show a temperature-enhanced adhesion strength by over six-fold up to 143 N cm-2 (4 mm × 4 mm), among the strongest pure CNT dry adhesives, over a temperature range from -196 to 1,000 °C. This unusual adhesion behaviour leads to temperature-enhanced electrical and thermal transports, enabling the CNT dry adhesive for efficient electrical and thermal management when being used as a conductive double-sided sticky tape. With its intrinsic thermal stability, our CNT adhesive sustains many temperature transition cycles over a wide operation temperature range. We discover that a 'nano-interlock' adhesion mechanism is responsible for the adhesion behaviour, which could be applied to the development of various dry CNT adhesives with novel features.

