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Profilometry of thin films on rough substrates by Raman spectroscopy
Martin Ledinský1, Bertrand Paviet-Salomon2, Aliaksei Vetushka1
1Laboratory of Nanostructures and Nanomaterials, Institute of Physics, Academy of Sciences of the Czech Republic, v. v. i., Cukrovarnická 10, 162 00 Prague, Czech Republic.
We developed a contactless Raman spectroscopy method to precisely measure thin film thickness on rough surfaces. This technique accurately maps amorphous silicon in solar cells, with potential for 2D material characterization.
Area of Science:
- Materials Science
- Nanotechnology
- Optics
Background:
- Thin films are crucial in semiconductor devices, but their precise characterization on rough substrates is challenging.
- Light-absorbing thin films can interfere with optical characterization techniques like Raman spectroscopy.
Purpose of the Study:
- To develop a contactless method for precise thickness profiling of thin films on rough substrates.
- To demonstrate the technique for amorphous silicon films used in silicon heterojunction solar cells.
Main Methods:
- Utilizing the signal attenuation effect of light-absorbing thin films on Raman spectroscopy.
- Employing spatially-resolved Raman measurements for thickness mapping.
Main Results:
- Achieved high-precision thickness mapping of amorphous silicon stripes on rough crystalline silicon.
- Demonstrated a thickness detection limit below 1 nanometer and spatial resolution down to 500 nanometers.
- Showcased applicability for thin layers on Raman/photoluminescence-active substrates and single-layer counting in 2D materials.
Conclusions:
- The developed Raman-based technique offers a non-destructive and highly accurate method for thin film characterization.
- This method has broad applicability in semiconductor manufacturing and advanced materials research, including 2D materials.
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