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Highly Manufacturable Deep (Sub-Millimeter) Etching Enabled High Aspect Ratio Complex Geometry Lego-Like Silicon
Mohamed Tarek Ghoneim1, Muhammad Mustafa Hussain1
1Integrated Nanotechnology Lab and Integrated Disruptive Electronic Applications (IDEA) Lab, King Abdullah University of Science and Technology, Thuwal, 23955-6900, Saudi Arabia.
Abstract:
A highly manufacturable deep reactive ion etching based process involving a hybrid soft/hard mask process technology shows high aspect ratio complex geometry Lego-like silicon electronics formation enabling free-form (physically flexible, stretchable, and reconfigurable) electronic systems.
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