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Published on: August 10, 2018
Miniature environmental chambers for temperature humidity bias testing of microelectronics
Michael David Hook1, Michael Mayer1
1Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario N2L 3G1, Canada.
The Review of Scientific Instruments
|April 5, 2017
Summary
Ten low-cost, small environmental chambers offer a flexible solution for reliability testing. This setup enables rapid characterization of environmental effects on microelectronics and materials, improving lifetime estimations.
Area of Science:
- Materials Science
- Electrical Engineering
- Reliability Engineering
Background:
- Environmental chambers are crucial for microelectronics reliability testing but are often large, costly, and restrict electrical connectivity.
- Existing solutions present limitations in terms of size, cost, and accessibility for electrical testing.
Purpose of the Study:
- To develop and present a system of multiple small, low-cost environmental chambers for enhanced reliability testing.
- To enable simultaneous testing under varied environmental conditions and facilitate rapid reliability assessment.
Main Methods:
- Construction of ten individual, compact environmental chambers.
- Utilizing water and glycerol mixtures for precise humidity control within chambers.
- Demonstrating humidity control across a range of 44% to 90% relative humidity.
- Achieving operational temperatures from 30 °C to 85 °C.
Main Results:
- Successfully achieved relative humidities from 44% to 90% and temperatures from 30 °C to 85 °C.
- Validated the capability to perform industry-standard 85% humidity at 85 °C testing.
- Demonstrated the advantage of parallel testing across multiple chambers for accelerated environmental stress analysis.
Conclusions:
- The developed system provides a cost-effective and versatile alternative to traditional large environmental chambers.
- This approach accelerates the characterization of environmental impacts on device reliability.
- Enables more accurate extrapolation of device lifetimes under operational conditions.

