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Related Experiment Videos

Cleaving Direct-Laser-Written Microstructures on Demand.

Markus M Zieger1,2, Patrick Mueller3,4, Alexander S Quick1

  • 1Preparative Macromolecular Chemistry, Institut für Technische Chemie und Polymerchemie, Karlsruhe Institute of Technology (KIT), Engesserstrasse 18, 76131, Karlsruhe, Germany.

Angewandte Chemie (International Ed. in English)
|April 14, 2017
PubMed
Summary

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This summary is machine-generated.

Researchers developed direct-laser-written 3D microstructures using reversible disulfide bonds. These structures degrade on demand via thiol-disulfide exchange, offering selective cleavage for advanced applications.

Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Nanotechnology

Background:

  • Direct-laser-written (DLW) 3D microstructures offer advanced fabrication capabilities.
  • Developing materials with controlled degradation is crucial for various applications.
  • Existing DLW materials often lack on-demand degradability or selective cleavage.

Purpose of the Study:

  • To introduce novel DLW 3D microstructures with on-demand degradation.
  • To utilize reversible disulfide bonds for controlled network cleavage.
  • To demonstrate the orthogonality of disulfide bond cleavage in DLW structures.

Main Methods:

  • Synthesis of a functional photoresist containing phenacyl sulfide linkers.
  • Direct-laser-writing (DLW) to form 3D microstructures via radical-free step-growth polymerization.
Keywords:
direct laser writingdisulfide networkmicrostructuresnetwork cleavagephenacyl sulfide

Related Experiment Videos

  • Verification of disulfide bond formation using electrospray ionization mass spectrometry (ESI-MS).
  • Induction of structure cleavage using dithiothreitol (DTT) via thiol-disulfide exchange.

    • Main Results:

    • Successfully fabricated DLW 3D microstructures composed exclusively of reversible disulfide bonds.
    • Demonstrated complete degradation of the microstructures on demand using dithiothreitol.
    • Confirmed the high orthogonality of disulfide bond cleavage, even in composite structures with non-reversible acrylate components.
    • Achieved high lateral resolution, creating line gratings with separations as small as 300 nm.

    Conclusions:

    • The developed photoresist enables the creation of 3D microstructures with on-demand degradation capabilities.
    • The disulfide bond chemistry provides a mild and orthogonal method for erasing DLW structures.
    • This technology holds promise for applications requiring temporary or selectively erasable microfabrication.