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Efficient Heat Dissipation of Uncooled 400-Gbps (16×25-Gbps) Optical Transceiver Employing Multimode VCSEL and PD
Tien-Tsorng Shih1, Yu-Chieh Chi2, Ruei-Nian Wang1
1Department of Electronic Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 80778, Taiwan.
Scientific Reports
|April 19, 2017
Summary
This study introduces an improved heat dissipation method for 400-Gbps optical transceivers using a brass core within the printed circuit board (PCB). This significantly reduces operating temperature, ensuring stable, high-performance data center applications.
Area of Science:
- Optoelectronics
- Thermal Management
- Optical Communications
Background:
- High-speed optical transceivers require effective heat dissipation for stable operation.
- Conventional printed circuit boards (PCBs) struggle with thermal management in high-power modules.
- Uncooled 400-Gbps Form-Factor Pluggable (CDFP) optical transceivers present significant thermal challenges.
Purpose of the Study:
- To propose and demonstrate an effective heat dissipation scheme for 400-Gbps CDFP optical transceiver modules.
- To investigate the thermal stability and performance of the proposed module under high-temperature conditions.
- To validate the suitability of the developed transceiver for data center applications.
Main Methods:
- Designed a novel CDFP transceiver incorporating a brass metal core embedded within the PCB for enhanced thermal conductivity.
- Simulated the thermal performance of the hollow PCB design with the brass core.
- Tested the transceiver's temperature stability, wavelength shift, and bit error rate (BER) over one hour of operation and 100-m multimode fiber transmission.
Main Results:
- The brass core assisted module exhibited a temperature increase of only 6.7°C, significantly lower than 28.3°C for conventional modules.
- Observed a minimal red-shift of 0.4-nm in central wavelength.
- Achieved a bit error rate (BER) <10-12, dispersion penalty of 2.6-dB, and power budget ≧ 3-dB over 100m OM4 fiber.
Conclusions:
- The proposed heat dissipation scheme using a brass metal core effectively manages heat in 400-Gbps CDFP transceivers.
- The module demonstrates high temperature and long-term operational stability, crucial for data centers.
- This low-cost, high-performance transceiver is well-suited for demanding data center environments.
