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Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics

Wansun Kim1, Inhwa Lee1, Dong Yoon Kim2

  • 1Department of Mechanical Engineering, KAIST, Daejeon, 305-701, Republic of Korea.

Nanotechnology
|April 20, 2017
PubMed
Summary

Researchers developed a new method using multiple neutral planes and soft adhesives to protect multiple brittle layers in organic electronic devices during bending. This strategy enhances device durability by minimizing stress on delicate components.

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