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Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics
Wansun Kim1, Inhwa Lee1, Dong Yoon Kim2
1Department of Mechanical Engineering, KAIST, Daejeon, 305-701, Republic of Korea.
Nanotechnology
|April 20, 2017
Summary
Researchers developed a new method using multiple neutral planes and soft adhesives to protect multiple brittle layers in organic electronic devices during bending. This strategy enhances device durability by minimizing stress on delicate components.
Area of Science:
- Materials Science
- Mechanical Engineering
- Organic Electronics
Background:
- Brittle layers in organic photovoltaic (OPV) devices are susceptible to damage during bending.
- The mechanical neutral plane strategy offers protection by minimizing stress on sensitive materials.
- Previous methods were limited to protecting a single layer at a specific location.
Purpose of the Study:
- To develop a method for protecting multiple brittle layers in OPVs at various locations.
- To enhance the mechanical robustness and durability of flexible organic electronic devices.
- To provide design guidelines for multilayer structures utilizing multiple neutral planes.
Main Methods:
- Generating multiple neutral planes using low elastic modulus adhesives.
- Employing quantitative analyses to control neutral plane locations.
- Demonstrating protection under both concave and convex bending.
- Utilizing finite element method (FEM) analysis for multilayer structures.
Main Results:
- Successfully protected multiple brittle layers at various locations using the proposed method.
- Demonstrated effective protection under both concave and convex bending conditions.
- FEM analysis provided insights into stress distribution in multilayer structures with soft adhesives.
Conclusions:
- The multiple neutral plane strategy effectively enhances the protection of brittle layers in flexible OPVs.
- Low elastic modulus adhesives are crucial for creating and controlling multiple neutral planes.
- The study provides valuable design guidelines for robust flexible organic electronic devices.