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Rapid reagent-less on-line H2O2 quantification in alkaline semiconductor etching solution.

Roumen Zlatev1, Margarita Stoytcheva1, Benjamin Valdez1

  • 1Universidad Autónoma de Baja California, Instituto de Ingeniería, Blvd. B. Juárez s/n, 21280 Mexicali, B.C., México.

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Summary

A new, reagent-less calorimetric method accurately quantifies hydrogen peroxide (H2O2) in semiconductor etching solutions. This rapid, on-line technique offers high specificity and efficiency for process control.

Keywords:
CalorimetryHydrogen peroxide quantificationSemiconductors etching solutions

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Area of Science:

  • Analytical Chemistry
  • Materials Science
  • Chemical Engineering

Background:

  • Accurate quantification of hydrogen peroxide (H2O2) is critical in semiconductor manufacturing, particularly in SC-1 alkaline etching solutions.
  • Existing methods may be time-consuming, require reagents, or lack specificity, impacting process control and yield.
  • On-line, automated monitoring is desirable for real-time process adjustments.

Purpose of the Study:

  • To develop a simple, rapid, and reagent-less calorimetric method for on-line H2O2 quantification.
  • To analytically characterize the method's performance, including specificity, speed, and sensitivity.
  • To validate the method using actual SC-1 alkaline etching solutions from semiconductor fabrication.

Main Methods:

  • Development of a calorimetric assay based on the catalytic decomposition of H2O2 by an immobilized solid catalyst.
  • Implementation of an automated, on-line system for continuous monitoring.
  • Analytical characterization involving specificity testing, quantification time measurement, and determination of linearity, RSD, and LOD.

Main Results:

  • The developed method demonstrated excellent specificity for H2O2, with no observed interference from other solution components.
  • Quantification time was less than 60 seconds, enabling rapid on-line analysis.
  • A wide linear concentration range (2.8 x 10^-2 to 2 mol/L) was achieved with relative standard deviation (RSD) from 4.7% to 1.8%, and a low limit of detection (LOD) of 9.3 x 10^-3 mol/L.

Conclusions:

  • A novel, reagent-less calorimetric method provides a simple, rapid, and specific means for on-line H2O2 quantification.
  • The method is suitable for real-time monitoring and control of SC-1 alkaline etching solutions in semiconductor technology.
  • This approach offers significant advantages in terms of speed, specificity, and operational simplicity over traditional methods.