Rapid reagent-less on-line H₂O₂ quantification in alkaline semiconductor etching solution

A simple, rapid, and reagent-less calorimetric method for H₂O₂ quantification, applicable automatically on-line was developed, analytically characterized and tested with real SC-1 alkaline etching solutions used in the semiconductor technology. Being based on H₂O₂ catalytic decomposition by immobilized solid catalyst, the proposed method possesses excellent specificity toward the H₂O₂ without any interference. The total quantification time was found to be less than 60s, RSD lies in the range from 4.7% to 1.8% for the linear concentration range from 2.8 10^-2 to 2molL^-1 respectively and the LOD was determined to be as low as 9.3 10^-3molL^-1.