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Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation
Huakai Shao1, Aiping Wu2, Yudian Bao1
1Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.
Ultrasonics Sonochemistry
|July 23, 2017
Summary
Ultrasonic irradiation significantly accelerates thermal grooving at silver-tin (Ag3Sn) grain boundaries, rapidly forming deep grooves. This process enhances intermetallic grain detachment and promotes vertical Ag3Sn grain growth, crucial for advanced soldering applications.
Area of Science:
- Materials Science
- Surface Science
- Acoustic Engineering
Background:
- Understanding interfacial reactions in solder joints is critical for electronic reliability.
- Silver-tin (Ag3Sn) intermetallics are key components in lead-free solder alloys.
- Grain boundary grooving influences solder joint morphology and mechanical properties.
Purpose of the Study:
- To investigate the effect of ultrasonic irradiation on the Ag3Sn-liquid Sn interface.
- To elucidate the mechanisms of thermal grooving under ultrasonic effects.
- To compare ultrasonic-assisted grooving with traditional methods.
Main Methods:
- Experimental investigation of Ag3Sn and liquid Sn interface.
- Application of ultrasonic irradiation.
- Microstructural analysis of grooving and grain morphology.
Main Results:
- Ultrasonic irradiation induced intensive thermal grooving at Ag3Sn grain boundaries within seconds.
- Groove deepening led to Ag3Sn grain detachment and promoted vertical growth.
- Compared to traditional methods (>10 min), ultrasonic grooving was significantly faster (<10 s).
Conclusions:
- Ultrasonic vibration, via acoustic cavitation and streaming, dramatically accelerates interfacial grooving.
- This rapid grooving enhances intermetallic grain detachment and modifies Ag3Sn grain morphology.
- Ultrasonic treatment offers a highly efficient method for manipulating solder interface structures.
