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A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism.
Yaqiu Li1, Weiwei Hu2,3, Yufeng Sun4
1Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China. ermao13@163.com.
This study develops a new model for plated through hole (PTH) reliability in multilayered printed circuit boards (PCBs). The model accurately predicts thermal fatigue failure, enhancing device lifetime assessments.
Area of Science:
- Materials Science
- Mechanical Engineering
- Electrical Engineering
Background:
- Plated through holes (PTHs) are critical for printed circuit board (PCB) reliability.
- Thermal fatigue deformation in PTHs is a primary factor limiting device lifetime.
- Existing PTH failure models often oversimplify by using a one-dimensional structure hypothesis, neglecting multilayered aspects and external pads.
Purpose of the Study:
- To develop a constitutive relation for multilayered PTHs.
- To establish a stress equation for improved PTH reliability analysis.
- To enhance the life prediction accuracy for multilayered PCBs.
Main Methods:
- Developed a constitutive relation for multilayered PTHs.
- Utilized finite element analysis (FEA) to determine stress distribution.
- Conducted thermal cycle tests for model validation.
Main Results:
- Established a stress equation for multilayered PTHs.
- Identified maximum stress locations within the PTH structure.
- Validated the life prediction model with experimental thermal cycle test data.
Conclusions:
- The developed model accurately predicts fatigue failure in multilayered PCBs.
- This model can be applied to portable diagnostic tools for fatigue failure.
- The research provides a robust method for multilayered PCB life prediction.
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