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Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and
Hoang-Phuong Phan, Han-Hao Cheng1, Toan Dinh
1Australian Institute for Bioengineering and Nanotechnology, The University of Queensland , Brisbane, Queensland 4072, Australia.
ACS Applied Materials & Interfaces
|August 10, 2017
Summary
We developed a new single-crystal silicon carbide (SiC) on glass platform, overcoming high-temperature leakage and light absorption issues. This transparent, insulating SiC-on-glass offers potential for advanced electronics and bio-integrated devices.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Physics
Background:
- Single-crystal cubic silicon carbide (SiC) is crucial for microelectromechanical systems (MEMS) and electronics.
- Current SiC/Si junctions face challenges with high-temperature current leakage and silicon substrate visible-light absorption.
- These limitations restrict SiC's application scope in demanding environments.
Purpose of the Study:
- To develop a novel single-crystal SiC platform on an electrically insulating and transparent substrate.
- To address the limitations of SiC/Si platforms, specifically high-temperature leakage and optical absorption.
- To enable broader applications of SiC in high-temperature electronics and bio-integrated devices.
Main Methods:
- Fabrication of SiC thin film on a 150 mm silicon wafer using Low-Pressure Chemical Vapor Deposition (LPCVD).
- Anodic bonding of the SiC/Si wafer to a glass substrate.
- Complete removal of the silicon layer via wafer polishing and wet etching.
- Characterization using deep profile X-ray photoelectron spectroscopy (DPXPS) and tensile testing.
Main Results:
- Achieved a sharp bonding interface (<15 nm) and strong bonding strength (~20 MPa).
- Demonstrated good optical transparency of the SiC/glass in the visible spectrum.
- Transferred SiC film exhibited excellent conductivity and a high temperature coefficient of resistance (-12,000 to -20,000 ppm/K).
- Confirmed biocompatibility through cell culture experiments with mouse 3T3 fibroblasts.
Conclusions:
- The developed SiC-on-glass platform effectively overcomes previous limitations of SiC/Si systems.
- The platform exhibits desirable electrical properties for thermal sensing and high-temperature electronics.
- Its transparency and biocompatibility open avenues for novel bio-integrated applications.
