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Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.

Chang-Chun Lee1, Tzai-Liang Tzeng2, Pei-Chen Huang3

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This study introduces a simulation method for three-dimensional integrated circuits (3D-ICs) using an equivalent material model. Optimizing wafer level underfill (WLUF) properties enhances microbump reliability and assembly integrity.

Keywords:
3D-IC packaginganalysis of varianceequivalent material propertiesfinite element analysismicrobump interconnect

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Semiconductor Manufacturing

Background:

  • Three-dimensional integrated circuits (3D-ICs) present challenges in analytical modeling due to scale mismatches.
  • Microbumps and wafer level underfill (WLUF) are critical components in 3D-IC assembly.
  • Accurate mechanical property characterization is essential for predicting 3D-IC reliability.

Purpose of the Study:

  • To develop a simulation technique for analyzing 3D-IC structures with scale mismatch.
  • To determine the mechanical properties of an equivalent material representing microbumps and WLUF.
  • To optimize 3D-IC structural reliability through factor analysis.

Main Methods:

  • Proposed a simulation technique introducing an equivalent material for microbumps and WLUF.
  • Obtained material properties (Young's modulus, Poisson's ratio, shear modulus, CTE) via tensile load, displacement, and thermal simulations.
  • Employed factorial experimental design and analysis of variance (ANOVA) for optimization.

Main Results:

  • Identified that at least eight outermost microbumps are necessary for accurate stress/strain analysis.
  • Determined that the coefficient of thermal expansion (CTE) of WLUF is the most significant factor influencing reliability.
  • Found that WLUF CTE impacts microbump reliability and structural warpage under thermal cycling and high-temperature bonding.

Conclusions:

  • An equivalent material model effectively simulates 3D-IC structures with scale mismatch.
  • Low CTE and high Young's modulus (E-value) for WLUF are recommended for enhanced assembly reliability.
  • Optimizing WLUF properties is crucial for mitigating stress and warpage in 3D-IC architectures.