Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface...

Area of Science:

• Materials Science
• Nanotechnology
• Polymer Science

Background:

• Modern electronics demand advanced thermal management due to increasing power density.
• Existing thermal interface materials (TIMs) face challenges in meeting next-generation semiconductor technology requirements.
• Flexible and highly conductive TIMs are crucial for efficient heat dissipation in compact devices.

Purpose of the Study:

• To develop novel flexible polymer nanocomposite TIMs for advanced thermal management.
• To enhance the thermal conductivity and electrical insulation of TIMs.
• To demonstrate the practical application of these TIMs in electronic devices.

Main Methods:

• Fabrication of aligned polyvinyl alcohol (PVA) supported boron nitride nanosheets (BNNSs) composite fiber membranes via electrospinning.
• Construction of nanocomposite TIMs by rolling PVA/BNNS membranes and vacuum-assisted impregnation with polydimethylsiloxane (PDMS).
• Characterization of thermal conductivity, electrical resistivity, and performance evaluation on a working LED chip.

Main Results:

• Achieved a ~10-fold increase in through-plane thermal conductivity compared to pristine PDMS at low BNNS loading (15.6 vol %).
• Demonstrated excellent electrical insulating properties (high volume electrical resistivity).
• Successfully validated thermal management capability by monitoring LED chip surface temperature.

Conclusions:

• The developed flexible polymer nanocomposite TIMs offer a promising solution for advanced thermal management.
• The strategy of using aligned BNNS within a polymer matrix provides significant thermal conductivity enhancement.
• These materials are suitable for high-power electronic applications requiring efficient and reliable heat dissipation.