Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Kibum Kang1,2,3, Kan-Heng Lee4,5, Yimo Han4

  • 1Department of Chemistry and Chemical Biology, Cornell University, Ithaca, New York 14853, USA.

Nature
|September 28, 2017
PubMed
Summary

Researchers developed a scalable method for creating uniform, atomic-precision semiconductor films using layer-by-layer assembly of 2D materials. This breakthrough enables high-quality heterostructures for advanced electronics and novel materials discovery.

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