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In situ high-resolution thermal microscopy on integrated circuits.
Optics Express
|October 19, 2017
Summary
This study introduces a new thermal microscopy technique for integrated circuits (ICs). It uses Rhodamine 6G fluorescence to rapidly image hotspots with sub-micrometer resolution, aiding defect prevention.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Miniaturization in integrated circuits (ICs) leads to heat dissipation issues.
- Current thermal analysis methods lack the resolution or speed for effective hotspot detection in ICs.
Purpose of the Study:
- To develop a fast, non-invasive thermal microscopy technique with sub-micrometer resolution for ICs.
- To demonstrate its application in locating critical hotspots that can cause defects.
Main Methods:
- Utilized the temperature-dependent two-photon fluorescence (TPF) intensity of Rhodamine 6G (R6G).
- Developed a novel, rapid, non-contact thermal microscopy system.
- Achieved sub-micrometer resolution for thermal imaging.
Main Results:
- Successfully generated high-resolution 2D thermal microscopic images of operating ICs.
- Visualized the generation, propagation, and distribution of heat.
- Demonstrated effective hotspot localization for potential defect identification.
Conclusions:
- The developed thermal microscopy offers a promising solution for in situ hotspot analysis in ICs.
- This technique can significantly aid in the optimization and development stages of integrated circuits.
