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Updated: Feb 18, 2026

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Stable Na plating/stripping electrochemistry realized by a 3D Cu current collector with thin nanowires
Yanying Lu1, Qiu Zhang, Mo Han
1Key Laboratory of Advanced Energy Materials Chemistry (Ministry of Education), College of Chemistry, Nankai University, Tianjin 300071, China. chenabc@nankai.edu.cn.
Abstract:
Current collectors have a significant role in Na plating and stripping. Here we demonstrate that a three-dimensional (3D) Cu current collector with thin nanowires (<40 nm) can significantly promote the electrochemical deposition stability of Na via tuning a Na metal plating model, therefore contributing to a high efficiency, long lifespan, and low overpotential during electrode/battery cycling.
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