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Published on: December 5, 2015
Vertical charge transport through transition metal dichalcogenides - a quantitative analysis
Yuqi Zhu1, Ruiping Zhou, Feng Zhang
1Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA. zhu273@purdue.edu.
Researchers studied vertical transport in transition metal dichalcogenide (TMD) devices. A new model explains transport mechanisms, revealing effective masses and interface barriers for MoS2 and WSe2.
Area of Science:
- Materials Science and Engineering
- Condensed Matter Physics
- Nanotechnology
Background:
- Transition metal dichalcogenides (TMDs) are promising 2D materials for electronic devices.
- Understanding vertical transport is crucial for developing novel TMD-based architectures.
- Previous studies primarily focused on lateral transport in TMD transistors.
Purpose of the Study:
- To experimentally evaluate and theoretically analyze truly vertical transport in multi-layer TMD devices.
- To develop a comprehensive model for vertical transport across varying electric fields and temperatures.
- To determine key material parameters, including effective vertical transport mass and interface barrier heights.
Main Methods:
- Fabrication and characterization of 28 two-terminal devices using multi-layer MoS2 and WSe2.
- Systematic investigation of electric field and temperature dependence of vertical transport.
- Development of a transport model analogous to gate leakage current in amorphous dielectrics.
Main Results:
- A quantitative model describing vertical transport as Fowler-Nordheim mediated at high fields and thermal injection dominated at low fields was established.
- The effective vertical transport mass was extracted for the first time: m*/m0 (MoS2) ≈ 0.18 and m*/m0 (WSe2) ≈ 0.14.
- Metal contact-to-TMD interface barrier heights were confirmed to be comparable to those in lateral TMD transistors.
Conclusions:
- The developed model provides a robust framework for understanding vertical charge transport in TMDs.
- The extracted effective masses and confirmed interface barriers are critical parameters for designing future vertical TMD devices.
- This work advances the understanding of fundamental transport mechanisms in 2D materials for electronic applications.
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