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Quantitative Atomic-Site Analysis of Functional Dopants/Point Defects in Crystalline Materials by Electron-Channeling-Enhanced Microanalysis
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Selectively Electron-Transparent Microstamping Toward Concurrent Digital Image Correlation and High-Angular

Timothy J Ruggles1, Geoffrey F Bomarito2, Andrew H Cannon3

  • 11National Institute of Aerospace,Hampton,VA,USA.

Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada
|December 5, 2017
PubMed
Summary
This summary is machine-generated.

A novel urethane microstamp enables in situ correlative microscopy by creating a Digital Image Correlation (DIC) pattern compatible with Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD) analysis.

Keywords:
EBSDdigital image correlationhigh-angular resolution EBSDlithographymicrostamping

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Area of Science:

  • Materials Science
  • Microscopy
  • Mechanical Engineering

Background:

  • Digital Image Correlation (DIC) and Electron Backscatter Diffraction (EBSD) offer complementary microscale deformation data.
  • Current methods prevent in situ combination due to incompatible surface preparation.

Purpose of the Study:

  • To develop a novel surface patterning method for in situ correlative DIC and EBSD analysis.
  • To overcome the limitations of existing techniques for microscale deformation studies.

Main Methods:

  • A urethane microstamp was developed for surface patterning.
  • The pattern provides contrast for DIC at low accelerating voltages.
  • The pattern is transparent at higher voltages for EBSD analysis.

Main Results:

  • The urethane microstamp is compatible with both DIC and EBSD.
  • Microstamping is cost-effective, repeatable, and suitable for complex geometries.
  • Enables in situ correlative analysis of local deformation.

Conclusions:

  • The urethane microstamp is a versatile and efficient tool for in situ correlative microscopy.
  • This method facilitates advanced microscale deformation analysis.
  • Opens new avenues for studying material behavior under load.